Chipmakers highlight China’s role

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The booth of Qualcomm at the fifth CIIE in Shanghai. [Photo/China Daily]

ASML, Intel, Qualcomm, TI swear by importance in global IC market

Prominent integrated circuit companies demonstrated their cutting-edge technologies at the fifth China International Import Expo, highlighting China's importance in the global semiconductor industrial chain amid external uncertainties.

IC companies from the United States, Japan, the Netherlands, South Korea and other countries set up large booths at the CIIE that concluded in Shanghai on Thursday.

Their large-scale participation reflects their enthusiasm to tap into the world's largest semiconductor market, experts said.

Shen Bo, senior vice-president of Dutch semiconductor equipment company ASML and president of ASML China, said, "This is the fourth time ASML has participated in the CIIE, and we hope to leverage the platform to continuously demonstrate our openness and collaboration."

Currently, ASML has 15 offices, 11 warehousing and logistics centers, three development centers, one training center and one maintenance center in the Chinese mainland, where more than 1,500 local employees run the operations.

China will continue to play an integral role in driving the development of a highly collaborative global semiconductor industry, ASML said.

Texas Instruments, a US chip company, has utilized the CIIE to announce its expansion in China. TI is expanding its assembly and test capacity in Chengdu, Sichuan province, and effecting automation upgrades to its Shanghai product distribution center.

Jiang Han, vice-president of TI and president of TI China, said: "We are excited to offer our customers stronger local support, address their needs quickly and efficiently, and help them succeed. The expansion … further underscores our deep commitment to supporting our customers in China."

Specifically, TI announced the installation of tools inside its second assembly and test factory in Chengdu to prepare for future production. Once fully operational, the unit will more than double TI's current assembly and test capacity in Chengdu.

At the CIIE, TI showcased how its analog and embedded processing products and technologies are helping manufacturers drive innovation in green grids, electric vehicles and robotics systems.

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Post time: Nov-29-2022

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